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After these requirements have been established for equipment installations at the Technology Development (TD) site, they are transferred via the Master Design Package, which documents how all process equipment is installed at high volume manufacturing sites. This includes ergonomic clearances for safe maintenance and operation, ventilation, spill control, gas detection, and all EHS aspects related to how the process equipment is installed. To accomplish this, EHS has integrated its requirements into the process equipment installation standards. These include combustible material restrictions to reduce fire risk and environmental characterization and emissions requirements to control and manage our site environmental permitting requirements for air, waste, and water emissions.Īfter the procurement of process equipment, it must be installed and integrated into facility systems. In addition, Intel-specific requirements are included to address other risks.
#Intel s. dobson series#
EHS requirements such as SEMI S2 (safety), SEMI S8 (ergonomics), and S10 (risk assessments) are just part of the "S" series of SEMI guidelines intended to define these industry safety standards for process equipment. Intel's EHS requirements for the procurement of process equipment are primarily driven to the front of the supplier chain through the Semiconductor Equipment Manufacturers Institute (SEMI) guideline process, an organization that develops standards for its members. The risk management and control of these risks starts by integrating EHS systems into the procurement and installation of process equipment, facilities design, safe commissioning, and pre-startup safety process of these new facilities. These materials are inherently hazardous, sometimes in small quantities, and therefore safety engineering is required to contain the hazard, reducing the risk to meetĪcceptable risk levels.
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toxic, corrosive, pyrophoric, flammable, etc.) materials. Today's semiconductor facilities utilize a multitude of hazardous materials, (e.g. SAFETY IN FACILITIES AND EQUIPMENT DESIGN The following describes the comprehensive Process Safety and Risk Management Program elements for these high hazard chemical systems. This included conducting numerous HazOp studies, consequence analysis on numerous scenarios, and a Layers of Protection Analysis (LOPA) in order to determine the risk management and control strategies.
#Intel s. dobson iso#
Intel has conducted numerous hazard assessments in conjunction with the ISO module and Isotainer supplier's and our Architectural and Engineering (A&E) consultant. It is well known in the gas industry that it is the package change which represents the highest risk for potential release. Doing this will increase the overall volume of the gas delivery package, but it will also greatly reduce projected package change frequency at advanced process factories by as much as 25X. To accommodate increases in demand, without increasing exposure risk, Intel utilizes industry standard DOT ISO module/trailer and Isotainer/trailers and bulk cryogenic supply tanks to provide process gas delivery, replacing smaller industry standard cylinders.
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Intel's advanced processes are consuming higher volumes of some hazardous gases than previous process technologies. Its Process Safety/Risk Management program described here addresses how Intel manages the risks associated with high hazard chemical processes to prevent accidental releases, fires, or injuries related to process upsets with high or catastrophic potential. Intel has a comprehensive Environmental, Health, and Safety Program that addresses all aspects of the life cycle of its processes, facilities, and products.